Solder paste column M705, flux, board washing h2o with absolute Liquor; board washing h2o is utilised to wash up the solder residue immediately after repair; thermal gel (specification: Fujipoly SPG-30B) is used to smear the floor from the chip immediately after repair ；ball-planting steel mesh, solder absorption wire, solder https://kabirb950ndr2.wikicorrespondent.com/user