CMP, also referred to as thermal oxidation sharpening, utilizes MP together with chemicals to enhance the MRR and enhance area quality [twenty]. Figure 2 illustrates the schematic of a typical CMP process [21]. The SiC wafer, which is fixed on the provider, along with the polishing pad shift relative to https://www.quora.com/profile/Trevor-Flatcher-2/Advantages-and-Challenges-of-Silicon-Carbide-Specialty-Ceramics-Macrocosm-Materials-Company-Overview-Founded-in-2016